● Masevhisi Edu: Imwe-stop PCB uye PCBA yemagetsi ekugadzira masevhisi
● PCB yekugadzira sevhisi: Inoda Gerber faira (CAM350 RS274X), PCB mafaira (Protel 99, AD, Eagle), nezvimwe.
● Zvikamu zvekutsvagisa masevhisi: BOM runyorwa rwaisanganisira yakadzama Chikamu nhamba uye Mugadziri
● PCB magungano masevhisi: Mafaira ari pamusoro apa uye Sarudza uye Isa mafaira, dhirowa yegungano
● Kuronga & Kuedza masevhisi: Chirongwa, introuction uye bvunzo nzira nezvimwe.
● Masevhisi egungano redzimba: 3D mafaera, nhanho kana zvimwe
● Reverse engineering services: Samples nevamwe
● Cable & waya gungano masevhisi: Kutsanangurwa & nevamwe
● Mamwe mabasa: Value-added services
PCB Technical Capacity
| Layer | Kugadzirwa kweMisa: 2 ~ 58 layer / Pilot run: 64 layer |
| Max.Ukobvu | Kugadzirwa kwakawanda: 394mil (10mm) / Pilot run: 17.5mm |
| Material | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead yemahara musangano zvinhu) , Halogen-Yemahara, Ceramic yakazadzwa, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, nezvimwe. |
| Min.Width/Spacing | Mukati memukati: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) |
| Max.Mhangura Kukora | UL yakasimbiswa: 6.0 OZ / Pilot run: 12OZ |
| Min.Hole Saizi | Mechanical Drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| Max.Panel Size | 1150mm × 560mm |
| Aspect ratio | 18:1 |
| Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Kunyudza Silver, ENEPIG, Gold Finger |
| Special Process | Gomba rakavigwa, Gomba Bofu, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, uye Resistance control. |
PCB Technical Capacity
| SMT | Kururama kwenzvimbo:20 um |
| Saizi yezvikamu:0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max.chikamu urefu::25mm | |
| Max.Saizi yePCB: 680 × 500mm | |
| Min.Saizi yePCB: hapana painogumira | |
| PCB ukobvu: 0.3 kusvika 6mm | |
| PCB uremu: 3KG | |
| Wave-Solder | Max.PCB upamhi: 450mm |
| Min.PCB hupamhi: hapana muganhu | |
| Kureba kwechikamu: Pamusoro 120mm / Bot 15mm | |
| Ziya-Solder | Metal mhando: chikamu, yakazara, inlay, parutivi |
| Metal zvinhu: Copper, Aluminium | |
| Pamusoro Pekupedzisira: plating Au, plating sliver, plating Sn | |
| Air dundira mwero: isingasviki 20% | |
| Press-fit | Press range:0-50KN |
| Max.Saizi yePCB: 800X600mm | |
| Testing | ICT, Probe kubhururuka, kupisa-mukati, basa bvunzo, tembiricha bhasikoro |
