Tine timu nyanzvi, kushandisa otomatiki, digitization kunatsiridza zvikuru pcb kugadzira kunyatsoshanda uye kuderedza PCB kutenga mutengo.uye inopa vashandisi zvigadzirwa zvePCB zvemhando yepamusoro, zvinodhura zvakanyanya, uye nekukurumidza kutumira.
●Rigid PCB (1 ~ 16layers)
●Flex PCB (1~6 akaturikidzana)
●RIgid-Flex PCB (1 ~ 6layers)
| Min.Width/Spacing | Mukati memukati: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) |
| Max.Mhangura Kukora | UL yakasimbiswa: 6.0 OZ / Pilot run: 12OZ |
| Min.Hole Saizi | Mechanical Drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| Max.Panel Size | 1150mm × 560mm |
| Aspect ratio | 18:1 |
| Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Kunyudza Silver, ENEPIG, Gold Finger |
| Special Process | Gomba rakavigwa, Gomba Bofu, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, uye Resistance control. |
