Computer uye Peripheral Equipment PCBA Board
Products feature
● -Nyaya: Fr-4
● -Layer Count: 14 layers
● -PCB Ukobvu: 1.6mm
● -Min.Trace / Space Outer: 4/4mil
● -Min.Drilled Hole: 0.25mm
● -Via Process: Tenting Vias
● -Surface Finish: ENIG
PCB chimiro maitiro
1. Solderresistant inki (Solderresistant/SolderMask): Haasi ese maface emhangura anofanirwa kudya mapatani erata, saka nzvimbo isingadyiwe inodhindwa nerunyoro rwezvinhu (kazhinji epoxy resin) inoparadzanisa nzvimbo yemhangura kubva pakudya. dzivisa kwete-soldering.Pane denderedzwa pfupi pakati pemitsetse yetinned.Zvinoenderana nemaitiro akasiyana, yakakamurwa kuita girinhi mafuta, tsvuku mafuta uye bhuruu mafuta.
2. Dielectric layer (Dielectric): Inoshandiswa kuchengetedza kuvharidzira pakati pemitsara uye zvidimbu, zvinowanzozivikanwa se substrate.
3. Surface treatment (SurtaceFinish): Sezvo mhangura yemhangura iri nyore oxidized munharaunda yakawanda, haigoni kuvharidzirwa (yakashata solderability), saka nzvimbo yemhangura ichave yakachengetedzwa.Nzira dzekudzivirira dzinosanganisira HASL, ENIG, Immersion Silver, Immersion TIn, uye organic solder preservative (OSP).Imwe neimwe nzira ine zvayakanakira nezvayakaipira, pamwe chete inonzi seyapamusoro kurapwa.
PCB Techinecal Capacity
| Layer | Kugadzirwa kweMisa: 2 ~ 58 layer / Pilot run: 64 layer |
| Max.Ukobvu | Kugadzirwa kwakawanda: 394mil (10mm) / Pilot run: 17.5mm |
| Material | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead yemahara musangano zvinhu) , Halogen-Yemahara, Ceramic yakazadzwa, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, nezvimwe. |
| Min.Width/Spacing | Mukati memukati: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) |
| Max.Mhangura Kukora | UL yakasimbiswa: 6.0 OZ / Pilot run: 12OZ |
| Min.Hole Saizi | Mechanical Drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| Max.Panel Size | 1150mm × 560mm |
| Aspect ratio | 18:1 |
| Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Kunyudza Silver, ENEPIG, Gold Finger |
| Special Process | Gomba rakavigwa, Gomba Bofu, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, uye Resistance control. |
Mabhodhi edu ePCBA akagadzirwa kuti asangane nezvido izvi zviri kukura nekupa mhinduro dzepamusoro-soro dzinobatanidza kumhanya, kushanda, uye kuchengetedza / kuchinjana ruzivo.Kunyangwe iwe uri wegore komputa sevhisi, muongorori mukuru wedata kana pasocial media platform, mabhodhi edu ePCBA akakunakira.
Iyo PCBA bhodhi yakagadzirwa neyemhando yepamusoro Fr-4 zvinhu kuti ive nechokwadi chekugara uye kuvimbika.Iyo ine gumi nemana akaturikidzana, ichipa nzvimbo yakakwana yezvikamu uye inogonesa kubatanidzwa kwedunhu repamusoro.Nehupamhi hwe 1.6mm, yakawana chiyero chakakwana pakati pekubatana uye kushanda.
Isu tinonzwisisa kukosha kwekurongeka kwekombuta, ndosaka tichigadzira mabhodhi ePCBA ane hushoma hwekutevera / nzvimbo yekunze ye4/4mil.Izvi zvinogonesa kufambisa kwemasaini uye kunoderedza njodzi yekukanganiswa.pamuganhu wakaderera.Iyo 0.25mm yekuchera saizi inogonesa kuenderana kwekushandisa, ichiita kuti ive yakakodzera kune akasiyana makomputa mamiriro.
Kukwenenzvera kuita uye kuchengetedza bhodhi, isu tinoshandisa tende kuburikidza nemaitiro anodzivirira chero hunyoro kana zvinosvibisa kupinda muPCB.Izvi zvinovimbisa kuvimbika kukuru uye hupenyu hwakareba kune yako komputa system.
Kupa kubatana kwepamusoro uye kuramba kwecorrosion, mabhodhi edu ePCBA anoratidza kupera kweENIG kunosanganisira dhadha regoridhe pamusoro penickel.Izvi zvinogonesa kubatana kwakasimba uye zvinowedzera kushanda kwese kwebhodhi.
Yedu komputa uye yeperipheral PCBA mabhodhi ndiyo yekupedzisira mhinduro kune yako komputa zvaunoda.Nezvimiro zvayo zvepamberi uye premium mhando, inovimbisa kuita kwakavimbika uye nekukurumidza kuchinjana ruzivo.Gara mberi kweshanduko yedhijitari nemabhodhi edu ePCBA emhando yepamusoro.
