Mumwe kumira zvemagetsi Server PCBA bhodhi mugadziri

Basa redu:

Nekuvandudzwa kwedata hombe, cloud computing uye 5G kutaurirana, kune mukana wakakura mune server / yekuchengetedza indasitiri.Iwo maseva anoratidzwa neakakwira-kumhanya CPU komputa kugona, kwenguva yakareba yakavimbika kushanda, yakasimba I / O yekunze data kubata kugona uye kuwedzera zviri nani.Suntak Tekinoroji yakazvipira kupa mabhodhi ekumhanya-mhanya uye akakwira akawanda-layer mabhodhi ane kuvimbika kwepamusoro, kugadzikana kwepamusoro uye kugona kukuru kwekushivirira kunodiwa kune sevhavha.

Tumira email kwatiri

Product Detail

Product Tags

Products feature

● Zvinyorwa: Fr-4

● Layer Count: 6 layers

● PCB Ukobvu: 1.2mm

● Min.Trace / Space Outer: 0.102mm / 0.1mm

● Min.Drilled Hole: 0.1mm

● Kuburikidza neMaitiro: Tente Vias

● Surface Finish: ENIG

PCB chimiro maitiro

1. Circuit uye muenzaniso (Pattern): Dunhu rinoshandiswa sechombo chekuitisa pakati pezvikamu.Muchigadziro, nzvimbo huru yemhangura ichagadzirwa seyakadzika pasi uye magetsi ekupa.Mitsetse uye mifananidzo inoitwa panguva imwe chete.

2. Gomba (Throughole/via): Iyo kuburikidza negomba inogona kuita kuti mitsetse yemazinga anopfuura maviri iite mumwe nemumwe, hombe kuburikidza negomba rinoshandiswa sechikamu plug-in, uye iyo isiri-conductive hole (nPTH) inowanzo shandiswa. sepamusoro Kukwira uye kuisa, inoshandiswa kugadzirisa screws panguva yegungano.

3. Solderresistant inki (Solderresistant/SolderMask): Haasi ese emhangura anofanirwa kudya zvidimbu zvemarata, saka nzvimbo isingadyiwe inodhindwa nerunyoro rwezvinhu (kazhinji epoxy resin) inoparadzanisa nzvimbo yemhangura kubva pakudya. dzivisa kwete-soldering.Pane denderedzwa pfupi pakati pemitsetse yetinned.Zvinoenderana nemaitiro akasiyana, yakakamurwa kuita girinhi mafuta, tsvuku mafuta uye bhuruu mafuta.

4. Dielectric layer (Dielectric): Inoshandiswa kuchengetedza kuvharidzira pakati pemitsara uye zvidimbu, zvinowanzozivikanwa se substrate.

PCBA technical Capacity

SMT	Kururama kwenzvimbo:20 um
	Saizi yezvikamu:0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP
	Max.chikamu urefu::25mm
	Max.Saizi yePCB: 680 × 500mm
	Min.Saizi yePCB: hapana painogumira
	PCB ukobvu: 0.3 kusvika 6mm
	PCB uremu: 3KG
Wave-Solder	Max.PCB upamhi: 450mm
	Min.PCB hupamhi: hapana muganhu
	Kureba kwechikamu: Pamusoro 120mm / Bot 15mm
Ziya-Solder	Metal mhando: chikamu, yakazara, inlay, parutivi
	Metal zvinhu: Copper, Aluminium
	Pamusoro Pekupedzisira: plating Au, plating sliver, plating Sn
	Air dundira mwero: isingasviki 20%
Press-fit	Press range:0-50KN
Press-fit	Max.Saizi yePCB: 800X600mm
Testing	ICT, Probe kubhururuka, kupisa-mukati, basa bvunzo, tembiricha bhasikoro