Computer uye Peripherals PCBA board
Products feature
● -Nyaya: Fr-4
● -Layer Count: 14 layers
● -PCB Ukobvu: 1.6mm
● -Min. Trace / Space Outer: 4/4mil
● -Min. Drilled Hole: 0.25mm
● -Via Process: Tenting Vias
● -Surface Finish: ENIG
PCB chimiro maitiro
1. Solderresistant inki (Solderresistant/SolderMask): Haasi ese maface emhangura anofanirwa kudya mapatani emarata, saka nzvimbo isingadyiwe inodhindwa nerunyoro rwezvinhu (kazhinji epoxy resin) inoparadzanisa nzvimbo yemhangura kubva pakudya. dzivisa kwete-soldering. Pane dunhu diki pakati pemitsetse yetinhi. Zvinoenderana nemaitiro akasiyana, yakakamurwa kuita girinhi mafuta, tsvuku mafuta uye bhuruu mafuta.
2. Dielectric layer (Dielectric): Inoshandiswa kuchengetedza kuvharidzira pakati pemitsara uye zvidimbu, zvinowanzozivikanwa se substrate.
3. Surface treatment (SurtaceFinish): Sezvo mhangura yemhangura iri nyore oxidized munharaunda yakawanda, haigoni kuiswa tinned (yakashata solderability), saka nzvimbo yemhangura ichave yakachengetedzwa. Nzira dzekudzivirira dzinosanganisira HASL, ENIG, Immersion Silver, Immersion TIn, uye organic solder preservative (OSP). Imwe neimwe nzira ine zvayakanakira nezvayakaipira, pamwe chete inonzi seyapamusoro kurapwa.
PCB Techinecal Capacity
| Layer | Kugadzirwa kweMisa: 2 ~ 58 layer / Pilot run: 64 layer |
| Max. Ukobvu | Kugadzirwa kwakawanda: 394mil (10mm) / Pilot run: 17.5mm |
| Material | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead yemahara musangano zvinhu), Halogen-Yemahara, Ceramic yakazadzwa, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, nezvimwe. |
| Min. Width/Spacing | Mukati memukati: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) |
| Max. Copper Kukora | UL yakasimbiswa: 6.0 OZ / Pilot run: 12OZ |
| Min. Hole Saizi | Mechanical Drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| Max. Panel Size | 1150mm × 560mm |
| Aspect ratio | 18:1 |
| Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Kunyudza Silver, ENEPIG, Gold Finger |
| Special Process | Gomba rakavigwa, Gomba Bofu, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, uye Resistance control. |
