Mumwe kumira zvemagetsi Security PCBA bhodhi mugadziri
Products feature
● Zvinyorwa: Fr-4
● Layer Count: 6 layers
● PCB Ukobvu: 1.2mm
● Min.Trace / Space Outer: 0.102mm / 0.1mm
● Min.Drilled Hole: 0.1mm
● Kuburikidza neMaitiro: Tente Vias
● Surface Finish: ENIG
Advantage
1) Makore eruzivo mukugadzirwa kwehafu-gomba, uchishandisa Da Chuan Routing muchina, kufambisa hafu-gomba wobva wafambisa chimiro, kusangana nezvinodiwa zvechimiro;
2) Minimum mutsetse upamhi uye mutsara mutsara: 0.065 / 0.065mm, shoma BGA pad: 0.2mm, kusangana dzakakosha zvinodiwa mutengi;
3) Electroplated Copper Flling of Blind Holes neUniversal DVCP (Double Track Vertical Continuous Copper Plating Equip ment) kuve nechokwadi chekuti hapana mavhodhi mumakomba uye mhando yezvigadzirwa zvevatengi;
4) Yakasimba sampling yekuongorora maitiro, inovimbisa vatengi 'chigadzirwa goho.
PCBA technical Capacity
| SMT | Kururama kwenzvimbo:20 um |
| Saizi yezvikamu:0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max.chikamu urefu::25mm | |
| Max.Saizi yePCB: 680 × 500mm | |
| Min.Saizi yePCB: hapana painogumira | |
| PCB ukobvu: 0.3 kusvika 6mm | |
| PCB uremu: 3KG | |
| Wave-Solder | Max.PCB upamhi: 450mm |
| Min.PCB hupamhi: hapana muganhu | |
| Kureba kwechikamu: Pamusoro 120mm / Bot 15mm | |
| Ziya-Solder | Metal mhando: chikamu, yakazara, inlay, parutivi |
| Metal zvinhu: Copper, Aluminium | |
| Pamusoro Pekupedzisira: plating Au, plating sliver, plating Sn | |
| Air dundira mwero: isingasviki 20% | |
| Press-fit | Press range:0-50KN |
| Max.Saizi yePCB: 800X600mm | |
| Testing | ICT, Probe kubhururuka, kupisa-mukati, basa bvunzo, tembiricha bhasikoro |
