Vehicle Electronics PCBA board
Products feature
● -Kuvimbika kuedza
● -Traceability
● -Thermal management
● -Mhangura inorema ≥ 105um
● -HDI
● -Semi - flex
● -Yakasimba - flex
● -High frequency milimita microwave
PCB chimiro maitiro
1. Dielectric layer (Dielectric): Inoshandiswa kuchengetedza kuvharidzira pakati pemitsara uye zvidimbu, zvinowanzozivikanwa se substrate.
2. Silkscreen (Legend / Marking / Silkscreen): Ichi chinhu chisingakoshi chikamu.Basa rayo guru nderekumaka zita uye chinzvimbo bhokisi rechikamu chega chega pabhodhi redunhu, iro rakanakira kugadzirisa uye kuzivikanwa mushure megungano.
3.Surface treatment (SurtaceFinish): Sezvo mhangura yemhangura iri nyore oxidized munharaunda yakawanda, haigoni kuiswa tinned (yakashata solderability), saka mhangura yemhangura ichave yakachengetedzwa.Nzira dzekudzivirira dzinosanganisira HASL, ENIG, Immersion Silver, Immersion TIn, uye organic solder preservative (OSP).Imwe neimwe nzira ine zvayakanakira nezvayakaipira, pamwe chete inonzi seyapamusoro kurapwa.
PCB Techinecal Capacity
| Layer | Kugadzirwa kweMisa: 2 ~ 58 layer / Pilot run: 64 layer |
| Max.Ukobvu | Kugadzirwa kwakawanda: 394mil (10mm) / Pilot run: 17.5mm |
| Material | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead yemahara musangano zvinhu) , Halogen-Yemahara, Ceramic yakazadzwa, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, nezvimwe. |
| Min.Width/Spacing | Mukati memukati: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) |
| Max.Mhangura Kukora | UL yakasimbiswa: 6.0 OZ / Pilot run: 12OZ |
| Min.Hole Saizi | Mechanical Drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| Max.Panel Size | 1150mm × 560mm |
| Aspect ratio | 18:1 |
| Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Kunyudza Silver, ENEPIG, Gold Finger |
| Special Process | Gomba rakavigwa, Gomba Bofu, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, uye Resistance control. |
