Mobile Phone PCBA board

Basa redu:

Iyo Mobibe Runhare PCB yakagadzirwa neShengyi S1000-2M zvinhu, iyo yepasi ndeye goridhe-yakaputirwa uye chikamu gobvu goridhe-yakaputirwa tekinoroji yekugadzira, iyo shoma aperture ndeye 0.15mm, iyo shoma mutsara upamhi uye mutsara spacing i120/85um, i yakanakira redunhu bhodhi kune optical faibha kutaurirana midziyo chigadzirwa.

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Product Detail

Product Tags

Products feature

● -HDI/Any-layer/mSAP

● -Fine line uye multilayer kugadzira kukwanisa

● -Advanced SMT uye mushure mekugadzira midziyo

● -Unyanzvi hwakanaka

● -Isolated basa bvunzo kugona

● -Kurasikirwa kwezvinhu

● -5G Antenna Chiitiko

Basa redu

● Masevhisi Edu: Imwe-stop PCB uye PCBA yemagetsi ekugadzira masevhisi

● PCB yekugadzira sevhisi: Inoda Gerber faira (CAM350 RS274X), PCB mafaira (Protel 99, AD, Eagle), nezvimwe.

● Zvikamu zvekutsvagisa masevhisi: BOM runyorwa rwaisanganisira yakadzama Chikamu nhamba uye Mugadziri

● PCB magungano masevhisi: Mafaira ari pamusoro apa uye Sarudza uye Isa mafaira, dhirowa yegungano

● Kuronga & Kuedza masevhisi: Chirongwa, introuction uye bvunzo nzira nezvimwe.

● Masevhisi egungano redzimba: 3D mafaera, nhanho kana zvimwe

● Reverse engineering services: Samples nevamwe

● Cable & waya gungano masevhisi: Kutsanangurwa & nevamwe

● Mamwe mabasa: Value-added services

PCB Techinecal Capacity

Layer	Kugadzirwa kweMisa: 2 ~ 58 layer / Pilot run: 64 layer
Max.Ukobvu	Kugadzirwa kwakawanda: 394mil (10mm) / Pilot run: 17.5mm
Material	FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead yemahara musangano zvinhu) , Halogen-Yemahara, Ceramic yakazadzwa, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, nezvimwe.
Min.Width/Spacing	Mukati memukati: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max.Mhangura Kukora	UL yakasimbiswa: 6.0 OZ / Pilot run: 12OZ
Min.Hole Saizi	Mechanical Drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Max.Panel Size	1150mm × 560mm
Aspect ratio	18:1
Surface Finish	HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Kunyudza Silver, ENEPIG, Gold Finger
Special Process	Gomba rakavigwa, Gomba Bofu, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, uye Resistance control.